Solder joint encapsulation material flux combines abilities

SHENMAO AMERICA SMEF-Z52 Flux solder joint encapsulation material combines the abilities of conventional flux and underfill. Epoxy cures after reflow and provides improved bonding strength, joint protection and reliability performance. Product is an active epoxy flux designed for SMT assembly (SAC paste) and BGA ball mount (SAC ball) processes. The activator helps to eliminate solder balls and form smooth solder joints. The flux residue is cured and provides mechanical support to the joint after reflow. Epoxy clad in solder joints after curing can protect these joints and increase joint strength by 30 percent compared to conventional rosin flux.

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